Manufacturer Part Number: | AM1707CZKB4 |
---|---|
Manufacturer: | T-I |
Product Category: | Embedded - Microprocessors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | ARM926EJ-S Microprocessor IC Sitara™ 1 Core, 32-Bit 456MHz 256-BGA (17x17) |
Lead Free Status / RoHS Status: | Lead free / Not applicable |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | Obsolete / Discontinued |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | AM1707CZKB4 Datasheet |
Internal Part Number | 898-AM1707CZKB4 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | C6747,5,3, OMAPL137, AM17x, D(A,H)8xx Series 17/12/2012 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Manufacturer | T I | |
Series | Sitara™ | |
Packaging | Tray | |
Part Status | Obsolete | |
Core Processor | ARM926EJ-S | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 456MHz | |
Co-Processors/DSP | System Control; CP15 | |
RAM Controllers | SDRAM | |
Graphics Acceleration | No | |
Display & Interface Controllers | LCD | |
Ethernet | 10/100 Mbps (1) | |
SATA | - | |
USB | USB 1.1 + PHY (1), USB 2.0 + PHY (1) | |
Voltage - I/O | 1.8V, 3.3V | |
Operating Temperature | 0°C ~ 90°C (TJ) | |
Security Features | - | |
Package / Case | 256-BGA | |
Supplier Device Package | 256-BGA (17x17) | |
Additional Interfaces | I²C, McASP, SPI, MMC/SD, UART | |
Standard Package | 90 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | AM1707CZKB4 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
AM1707CZKB4 is in stock for immediate shipping now. We are the distributor of T-I all series components. The condition of AM1707CZKB4 is new and unused, you can buy AM1707CZKB4 T-I with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for AM1707CZKB4.
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