Manufacturer Part Number: | APTGF150A60T3AG |
---|---|
Manufacturer: | Microsemi Corporation |
Product Category: | Transistors - IGBTs - Modules |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | IGBT Module NPT Half Bridge 600V 230A 833W Chassis Mount SP3 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | APTGF150A60T3AG Datasheet |
Internal Part Number | 898-APTGF150A60T3AG | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | SP3F Plastic Frame Update 16/Jul/2015 | |
PCN Part Status Change | Power Module Disc 23/Mar/2016 | |
Category | Discrete Semiconductor Products | |
Family | Transistors - IGBTs - Modules | |
Manufacturer | Microsemi Corporation | |
Series | - | |
Part Status | Not For New Designs | |
IGBT Type | NPT | |
Configuration | Half Bridge | |
Voltage - Collector Emitter Breakdown (Max) | 600V | |
Current - Collector (Ic) (Max) | 230A | |
Power - Max | 833W | |
Vce(on) (Max) @ Vge, Ic | 2.5V @ 15V, 200A | |
Current - Collector Cutoff (Max) | 350µA | |
Input Capacitance (Cies) @ Vce | 9nF @ 25V | |
Input | Standard | |
NTC Thermistor | Yes | |
Mounting Type | Chassis Mount | |
Package / Case | SP3 | |
Supplier Device Package | SP3 | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | APTGF150A60T3AG | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
APTGF150A60T3AG is in stock for immediate shipping now. We are the distributor of Microsemi Corporation all series components. The condition of APTGF150A60T3AG is new and unused, you can buy APTGF150A60T3AG Microsemi Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for APTGF150A60T3AG.
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