Manufacturer Part Number: | BSP89L6327HTSA1 |
---|---|
Manufacturer: | Infineon Technologies |
Product Category: | Transistors - FETs, MOSFETs - Single |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | MOSFET N-CH 240V 350MA SOT-223 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | Obsolete / Discontinued |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | BSP89L6327HTSA1 Datasheet |
Internal Part Number | 898-BSP89L6327HTSA1 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Discrete Semiconductor Products | |
Family | Transistors - FETs, MOSFETs - Single | |
Manufacturer | Infineon Technologies | |
Series | SIPMOS® | |
Packaging | Tape & Reel (TR) | |
Part Status | Obsolete | |
FET Type | MOSFET N-Channel, Metal Oxide | |
FET Feature | Logic Level Gate, 4.5V Drive | |
Drain to Source Voltage (Vdss) | 240V | |
Current - Continuous Drain (Id) @ 25°C | 350mA (Ta) | |
Rds On (Max) @ Id, Vgs | 6 Ohm @ 350mA, 10V | |
Vgs(th) (Max) @ Id | 1.8V @ 108µA | |
Gate Charge (Qg) @ Vgs | 6.4nC @ 10V | |
Input Capacitance (Ciss) @ Vds | 140pF @ 25V | |
Power - Max | 1.8W | |
Operating Temperature | -55°C ~ 150°C (TJ) | |
Mounting Type | Surface Mount | |
Package / Case | TO-261-4, TO-261AA | |
Supplier Device Package | PG-SOT223-4 | |
Standard Package | 1,000 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | BSP89L6327HTSA1 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
BSP89L6327HTSA1 is in stock for immediate shipping now. We are the distributor of Infineon Technologies all series components. The condition of BSP89L6327HTSA1 is new and unused, you can buy BSP89L6327HTSA1 Infineon Technologies with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for BSP89L6327HTSA1.
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