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| Manufacturer Part Number: | BU2506FV-E2 |
|---|---|
| Manufacturer: | Rohm Semiconductor |
| Product Category: | Data Acquisition - Digital to Analog Converters (DAC) |
| Available Quantity: | 11510 Pieces |
| Unit Price: | Quote by Email |
| Description: | 10 Bit Digital to Analog Converter 8 20-SSOP-B |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | BU2506FV-E2 Datasheet |
| Internal Part Number | 898-BU2506FV-E2 | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| Online Catalog | 10-Bit | |
| Category | Integrated Circuits (ICs) | |
| Family | Data Acquisition - Digital to Analog Converters (DAC) | |
| Manufacturer | Rohm Semiconductor | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Part Status | Active | |
| Number of Bits | 10 | |
| Number of D/A Converters | 8 | |
| Settling Time | 20µs | |
| Output Type | Voltage - Buffered | |
| Differential Output | No | |
| Data Interface | SPI | |
| Reference Type | - | |
| Voltage - Supply, Analog | 5V | |
| Voltage - Supply, Digital | 5V | |
| INL/DNL (LSB) | ±3.5, ±1 | |
| Architecture | R-2R | |
| Operating Temperature | -30°C ~ 85°C | |
| Package / Case | 20-LSSOP (0.173", 4.40mm Width) | |
| Supplier Device Package | 20-SSOP-B | |
| Standard Package | 2,500 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | BU2506FV-E2 | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
BU2506FV-E2 is in stock for immediate shipping now. We are the distributor of Rohm Semiconductor all series components. The condition of BU2506FV-E2 is new and unused, you can buy BU2506FV-E2 Rohm Semiconductor with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for BU2506FV-E2.
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