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| Manufacturer Part Number: | CY62137FV30LL-55ZSXET |
|---|---|
| Manufacturer: | Cypress Semiconductor Corp |
| Product Category: | Memory |
| Available Quantity: | 9010 Pieces |
| Unit Price: | Quote by Email |
| Description: | IC SRAM 2MBIT 55NS 44TSOP |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Production Status (Lifecycle): | In Production |
| Delivery Time: | 1-2 Days |
| Date Code (D/C): | New |
| Datasheet Download: | CY62137FV30LL-55ZSXET Datasheet |
| Internal Part Number | 898-CY62137FV30LL-55ZSXET | |
| Manufacturer Lead time | 6-8 weeks | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | Qualification of Polyimide Process 13/Dec/2013 Qualification Tape Supplier 18/Mar/2014 | |
| PCN Packaging | New Tray and TR Materials 13/Dec/2013 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Manufacturer | Cypress Semiconductor Corp | |
| Series | MoBL® | |
| Packaging | Tape & Reel (TR) | |
| Part Status | Active | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Asynchronous | |
| Memory Size | 2M (128K x 16) | |
| Speed | 55ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.2 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 125°C (TA) | |
| Package / Case | 44-TSOP (0.400", 10.16mm Width) | |
| Supplier Device Package | 44-TSOP II | |
| Standard Package | 1,000 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Replacement Part | CY62137FV30LL-55ZSXET | |
| Country of Origin | USA / JAPAN / Philippines / Malaysia | |
| MOQ | 1 Piece | |
| Picture / Image / Photo | Send via email | |
CY62137FV30LL-55ZSXET is in stock for immediate shipping now. We are the distributor of Cypress Semiconductor Corp all series components. The condition of CY62137FV30LL-55ZSXET is new and unused, you can buy CY62137FV30LL-55ZSXET Cypress Semiconductor Corp with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for CY62137FV30LL-55ZSXET.
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