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DSPIC33FJ16MC101T-I/SO

DSPIC33FJ16MC101T-I/SO
Manufacturer Part Number:DSPIC33FJ16MC101T-I/SO
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:dsPIC dsPIC™ 33F Microcontroller IC 16-Bit 16 MIPs 16KB (16K x 8) FLASH 20-SOIC
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):1 (Unlimited)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: DSPIC33FJ16MC101T-I/SO Datasheet
DSPIC33FJ16MC101T-I/SO´s Parameters
Internal Part Number898-DSPIC33FJ16MC101T-I/SO
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesBluetooth Audio Development Platform
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationErrata/Datasheet Update 23/Jan/2014
PCN PackagingLabel and Packing Changes 23/Sep/2015
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesdsPIC™ 33F
PackagingTape & Reel (TR)
Part StatusActive
Core ProcessordsPIC
Core Size16-Bit
Speed16 MIPs
ConnectivityI²C, IrDA, LIN, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, Motor Control PWM, POR, PWM, WDT
Number of I/O15
Program Memory Size16KB (16K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size1K x 8
Voltage - Supply (Vcc/Vdd)3 V ~ 3.6 V
Data ConvertersA/D 4x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Package / Case20-SOIC (0.295", 7.50mm Width)
Supplier Device Package20-SOIC
Standard Package 1,600
Weight0.001 KG
ApplicationEmail for details
Replacement PartDSPIC33FJ16MC101T-I/SO
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

DSPIC33FJ16MC101T-I/SO is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of DSPIC33FJ16MC101T-I/SO is new and unused, you can buy DSPIC33FJ16MC101T-I/SO Microchip Technology with us at a very low price and quick delivery.

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