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DSPIC33FJ64GS606-E/MR

DSPIC33FJ64GS606-E/MR
Manufacturer Part Number:DSPIC33FJ64GS606-E/MR
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:dsPIC dsPIC™ 33F Microcontroller IC 16-Bit 40 MIPs 64KB (64K x 8) FLASH 64-QFN (9x9)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: DSPIC33FJ64GS606-E/MR Datasheet
DSPIC33FJ64GS606-E/MR´s Parameters
Internal Part Number898-DSPIC33FJ64GS606-E/MR
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesInterleaved Power Factor Correction
Bluetooth Audio Development Platform
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationDSPIC33FJyyGS Datasheet Update 17/Jul/2014
Errata Update 22/Oct/2014
Mold Compound Update 31/Oct/2014
New DeviceDoc 09/Feb/2016
PCN Assembly/OriginAssembly Site Addition 22/Jun/2015
PCN PackagingLabel and Packing Changes 23/Sep/2015
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesdsPIC™ 33F
PackagingTube
Part StatusActive
Core ProcessordsPIC
Core Size16-Bit
Speed40 MIPs
ConnectivityCAN, I²C, IrDA, LIN, SPI, UART/USART, USB
PeripheralsBrown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
Number of I/O58
Program Memory Size64KB (64K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size9K x 8
Voltage - Supply (Vcc/Vdd)3 V ~ 3.6 V
Data ConvertersA/D 16x10b; D/A 1x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 125°C (TA)
Package / Case64-VFQFN Exposed Pad
Supplier Device Package64-QFN (9x9)
Standard Package 40
Weight0.001 KG
ApplicationEmail for details
Replacement PartDSPIC33FJ64GS606-E/MR
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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