Manufacturer Part Number: | KMPC855TCVR66D4 |
---|---|
Manufacturer: | NXP Semiconductors |
Product Category: | Embedded - Microprocessors |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | Obsolete / Discontinued |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | KMPC855TCVR66D4 Datasheet |
Internal Part Number | 898-KMPC855TCVR66D4 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Manufacturer | Freescale Semiconductor - NXP | |
Series | MPC8xx | |
Packaging | Tray | |
Part Status | Obsolete | |
Core Processor | MPC8xx | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 66MHz | |
Co-Processors/DSP | Communications; CPM | |
RAM Controllers | DRAM | |
Graphics Acceleration | No | |
Display & Interface Controllers | - | |
Ethernet | 10 Mbps (1), 10/100 Mbps (1) | |
SATA | - | |
USB | - | |
Voltage - I/O | 3.3V | |
Operating Temperature | -40°C ~ 95°C (TA) | |
Security Features | - | |
Package / Case | 357-BBGA | |
Supplier Device Package | 357-PBGA (25x25) | |
Additional Interfaces | HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART | |
Standard Package | 2 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | KMPC855TCVR66D4 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
KMPC855TCVR66D4 is in stock for immediate shipping now. We are the distributor of NXP Semiconductors all series components. The condition of KMPC855TCVR66D4 is new and unused, you can buy KMPC855TCVR66D4 NXP Semiconductors with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for KMPC855TCVR66D4.
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