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LPC1114FHN33/201,5

LPC1114FHN33/201,5
Manufacturer Part Number:LPC1114FHN33/201,5
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9139 Pieces
Unit Price:Quote by Email
Description:ARM® Cortex®-M0 LPC1100L Microcontroller IC 32-Bit 50MHz 32KB (32K x 8) FLASH 32-HVQFN (7x7)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: LPC1114FHN33/201,5 Datasheet
LPC1114FHN33/201,5´s Parameters
Internal Part Number898-LPC1114FHN33/201,5
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Mfg Application NotesLPC111x,13xx Appl Note
Product Training ModulesLPCXpresso Development Platform
Code Density for LPC11xx
Design ResourcesDevelopment Tool Selector
Featured ProductLPC1100 Series 50-MHz, 32-bit Cortex-M0™ Microcontrollers
EDA / CAD Models Download from Accelerated Designs
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerNXP Semiconductors
SeriesLPC1100L
PackagingTray
Part StatusActive
Core ProcessorARM® Cortex®-M0
Core Size32-Bit
Speed50MHz
ConnectivityI²C, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, POR, WDT
Number of I/O28
Program Memory Size32KB (32K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size4K x 8
Voltage - Supply (Vcc/Vdd)1.8 V ~ 3.6 V
Data ConvertersA/D 8x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Package / Case32-VQFN Exposed Pad
Supplier Device Package32-HVQFN (7x7)
Standard Package 260
Weight0.001 KG
ApplicationEmail for details
Replacement PartLPC1114FHN33/201,5
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

LPC1114FHN33/201,5 is in stock for immediate shipping now. We are the distributor of NXP Semiconductors all series components. The condition of LPC1114FHN33/201,5 is new and unused, you can buy LPC1114FHN33/201,5 NXP Semiconductors with us at a very low price and quick delivery.

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