Manufacturer Part Number: | M2S025T-1FCSG325 |
---|---|
Manufacturer: | Microsemi Corporation |
Product Category: | Embedded - System On Chip (SoC) |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 25K Logic Modules 256KB 64KB 166MHz 325-BGA (11x11) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | M2S025T-1FCSG325 Datasheet |
Internal Part Number | 898-M2S025T-1FCSG325 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Multiple Changes 17/Sep/2015 Timing Chg 17/May/2016 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Manufacturer | Microsemi Corporation | |
Series | SmartFusion®2 | |
Packaging | Tray | |
Part Status | Active | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DDR, PCIe, SERDES | |
Connectivity | CAN, Ethernet, I²C, SPI, UART/USART, USB | |
Speed | 166MHz | |
Primary Attributes | FPGA - 25K Logic Modules | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 325-TFBGA | |
Supplier Device Package | 325-BGA (11x11) | |
Number of I/O | 180 | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | M2S025T-1FCSG325 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
M2S025T-1FCSG325 is in stock for immediate shipping now. We are the distributor of Microsemi Corporation all series components. The condition of M2S025T-1FCSG325 is new and unused, you can buy M2S025T-1FCSG325 Microsemi Corporation with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for M2S025T-1FCSG325.
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