Manufacturer Part Number: | MCP25025-I/SL |
---|---|
Manufacturer: | Microchip Technology |
Product Category: | Interface - I/O Expanders |
Available Quantity: | 9010 Pieces |
Unit Price: | Quote by Email |
Description: | I/O Expander 8 CAN (1-Wire) 4MHz 14-SOIC |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | MCP25025-I/SL Datasheet |
Internal Part Number | 898-MCP25025-I/SL | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Copper Bond Wire 09/Mar/2015 Copper Bond Wire 5/Nov/2015 | |
PCN Assembly/Origin | Qualification Copper Bond Wire 31/Oct/2014 | |
PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
Category | Integrated Circuits (ICs) | |
Family | Interface - I/O Expanders | |
Manufacturer | Microchip Technology | |
Series | - | |
Packaging | Tube | |
Part Status | Active | |
Number of I/O | 8 | |
Interface | CAN (1-Wire) | |
Interrupt Output | No | |
Features | ADC, EEPROM, PWM | |
Output Type | Push-Pull | |
Current - Output Source/Sink | 25mA | |
Frequency - Clock | 4MHz | |
Voltage - Supply | 2.7 V ~ 5.5 V | |
Operating Temperature | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Package / Case | 14-SOIC (0.154", 3.90mm Width) | |
Supplier Device Package | 14-SOIC | |
Standard Package | 57 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | MCP25025-I/SL | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
MCP25025-I/SL is in stock for immediate shipping now. We are the distributor of Microchip Technology all series components. The condition of MCP25025-I/SL is new and unused, you can buy MCP25025-I/SL Microchip Technology with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for MCP25025-I/SL.
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