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PIC32MX330F064L-V/TL

PIC32MX330F064L-V/TL
Manufacturer Part Number:PIC32MX330F064L-V/TL
Manufacturer:
Product Category:Embedded - Microcontrollers
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:MIPS32® M4K™ PIC® 32MX Microcontroller IC 32-Bit 80MHz 64KB (64K x 8) FLASH 124-VTLA (9x9)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: PIC32MX330F064L-V/TL Datasheet
PIC32MX330F064L-V/TL´s Parameters
Internal Part Number898-PIC32MX330F064L-V/TL
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Product Training ModulesBluetooth Audio Development Platform
Design ResourcesDevelopment Tool Selector
PCN Design/SpecificationPIC32MX330 Family Datasheet 25/Jun/2013
Datasheet Update 18/Oct/2013
Errata and Datasheet Update 21/Oct/2013
Errata/Datasheet Update 05/Jun/2014
Errata/Datasheet Update 10/Feb/2015
Errata/Datasheet Update 25/Jun/2015
PIC32MX330,350,370,430,450,470 Datasheet Rev 2/Nov/2015
PCN PackagingLabel and Packing Changes 23/Sep/2015
Article LibraryCreating Low-Cost Bluetooth Audio Applications with 32-bit MCUs
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - Microcontrollers
ManufacturerMicrochip Technology
SeriesPIC® 32MX
PackagingTube
Part StatusActive
Core ProcessorMIPS32® M4K™
Core Size32-Bit
Speed80MHz
ConnectivityI²C, IrDA, LIN, PMP, SPI, UART/USART
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O85
Program Memory Size64KB (64K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size16K x 8
Voltage - Supply (Vcc/Vdd)2.3 V ~ 3.6 V
Data ConvertersA/D 28x10b
Oscillator TypeInternal
Operating Temperature-40°C ~ 105°C (TA)
Package / Case124-VFTLA Dual Row Exposed Pad
Supplier Device Package124-VTLA (9x9)
Standard Package 40
Weight0.001 KG
ApplicationEmail for details
Replacement PartPIC32MX330F064L-V/TL
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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