Manufacturer Part Number: | TLV2242ID |
---|---|
Manufacturer: | T-I |
Product Category: | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps |
Available Quantity: | 9044 Pieces |
Unit Price: | Quote by Email |
Description: | General Purpose Amplifier 2 Circuit Rail-to-Rail 8-SOIC |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | TLV2242ID Datasheet |
Internal Part Number | 898-TLV2242ID | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Online Catalog | General Purpose | |
Category | Integrated Circuits (ICs) | |
Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
Manufacturer | T I | |
Series | - | |
Packaging | Tube | |
Part Status | Active | |
Amplifier Type | General Purpose | |
Number of Circuits | 2 | |
Output Type | Rail-to-Rail | |
Slew Rate | 0.002 V/µs | |
Gain Bandwidth Product | 5.5kHz | |
-3db Bandwidth | - | |
Current - Input Bias | 100pA | |
Voltage - Input Offset | 600µV | |
Current - Supply | 1µA | |
Current - Output / Channel | 200µA | |
Voltage - Supply, Single/Dual (±) | 2.5 V ~ 12 V, ±1.25 V ~ 6 V | |
Operating Temperature | -40°C ~ 85°C | |
Mounting Type | Surface Mount | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
Supplier Device Package | 8-SOIC | |
Standard Package | 75 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | TLV2242ID | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
TLV2242ID is in stock for immediate shipping now. We are the distributor of T-I all series components. The condition of TLV2242ID is new and unused, you can buy TLV2242ID T-I with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for TLV2242ID.
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