Manufacturer Part Number: | TLV2252QDRQ1 |
---|---|
Manufacturer: | T-I |
Product Category: | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps |
Available Quantity: | 10486 Pieces |
Unit Price: | Quote by Email |
Description: | General Purpose Amplifier 2 Circuit Rail-to-Rail 8-SOIC |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Production Status (Lifecycle): | In Production |
Delivery Time: | 1-2 Days |
Date Code (D/C): | New |
Datasheet Download: | TLV2252QDRQ1 Datasheet |
Internal Part Number | 898-TLV2252QDRQ1 | |
Manufacturer Lead time | 6-8 weeks | |
Condition | New & Unused, Original Sealed | |
Online Catalog | General Purpose | |
Category | Integrated Circuits (ICs) | |
Family | Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps | |
Manufacturer | T I | |
Series | Automotive, AEC-Q100, LinCMOS™ | |
Packaging | Digi-Reel® | |
Part Status | Active | |
Amplifier Type | General Purpose | |
Number of Circuits | 2 | |
Output Type | Rail-to-Rail | |
Slew Rate | 0.12 V/µs | |
Gain Bandwidth Product | 200kHz | |
-3db Bandwidth | - | |
Current - Input Bias | 1pA | |
Voltage - Input Offset | 200µV | |
Current - Supply | 70µA | |
Current - Output / Channel | 50mA | |
Voltage - Supply, Single/Dual (±) | 2.7 V ~ 16 V, ±1.35 V ~ 8 V | |
Operating Temperature | -40°C ~ 125°C | |
Mounting Type | Surface Mount | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
Supplier Device Package | 8-SOIC | |
Standard Package | 1 | |
Weight | 0.001 KG | |
Application | Email for details | |
Replacement Part | TLV2252QDRQ1 | |
Country of Origin | USA / JAPAN / Philippines / Malaysia | |
MOQ | 1 Piece | |
Picture / Image / Photo | Send via email |
TLV2252QDRQ1 is in stock for immediate shipping now. We are the distributor of T-I all series components. The condition of TLV2252QDRQ1 is new and unused, you can buy TLV2252QDRQ1 T-I with us at a very low price and quick delivery.
Please kindly send us an email if you have any demands for TLV2252QDRQ1.
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