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XC7Z100-1FFG1156I

XC7Z100-1FFG1156I
Manufacturer Part Number:XC7Z100-1FFG1156I
Manufacturer:
Product Category:Embedded - System On Chip (SoC)
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 256KB 667MHz 1156-FCBGA (35x35)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):4 (72 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: XC7Z100-1FFG1156I Datasheet
XC7Z100-1FFG1156I´s Parameters
Internal Part Number898-XC7Z100-1FFG1156I
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
Featured ProductZynq®-7 SoC
PCN Design/SpecificationZynq-7000 AP Requirement 28/Sep/2015
PCN Assembly/OriginSubstrate Supplier Addition 03/Nov/2014
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - System On Chip (SoC)
ManufacturerXilinx Inc.
SeriesZynq®-7000
PackagingTray
Part StatusActive
ArchitectureMCU, FPGA
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
MCU Flash-
MCU RAM256KB
PeripheralsDMA
ConnectivityCAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed667MHz
Primary AttributesKintex™-7 FPGA, 444K Logic Cells
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1156-BBGA, FCBGA
Supplier Device Package1156-FCBGA (35x35)
Number of I/O250
Standard Package 1
Weight0.001 KG
ApplicationEmail for details
Replacement PartXC7Z100-1FFG1156I
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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