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M2S060-FGG676

M2S060-FGG676
Manufacturer Part Number:M2S060-FGG676
Manufacturer:
Product Category:Embedded - System On Chip (SoC)
Available Quantity:9010 Pieces
Unit Price:Quote by Email
Description:ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 60K Logic Modules 256KB 64KB 166MHz 676-FBGA (27x27)
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL):3 (168 Hours)
Production Status (Lifecycle):In Production
Delivery Time:1-2 Days
Date Code (D/C):New
Datasheet Download: M2S060-FGG676 Datasheet
M2S060-FGG676´s Parameters
Internal Part Number898-M2S060-FGG676
Manufacturer Lead time6-8 weeks
ConditionNew & Unused, Original Sealed
PCN Design/SpecificationMultiple Changes 17/Sep/2015
Lock Setting Chg 11/May/2016
Timing Chg 17/May/2016
Timing Chg 17/May/2016
CategoryIntegrated Circuits (ICs)
FamilyEmbedded - System On Chip (SoC)
ManufacturerMicrosemi Corporation
SeriesSmartFusion®2
PackagingTray
Part StatusActive
ArchitectureMCU, FPGA
Core ProcessorARM® Cortex®-M3
MCU Flash256KB
MCU RAM64KB
PeripheralsDDR, PCIe, SERDES
ConnectivityCAN, Ethernet, I²C, SPI, UART/USART, USB
Speed166MHz
Primary AttributesFPGA - 60K Logic Modules
Operating Temperature0°C ~ 85°C (TJ)
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)
Number of I/O387
Standard Package 1
Weight0.001 KG
ApplicationEmail for details
Replacement PartM2S060-FGG676
Country of OriginUSA / JAPAN / Philippines / Malaysia
MOQ1 Piece
Picture / Image / PhotoSend via email

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